CONGRESS SECRETARIAT
Meetx is the congress bureau handling the secretariat for CIRP 2025.
E-mail: cirp2025@meetx.se
IMPORTANT DATES
Registration opens: 10 March 2025
Early-bird registration closes: 31 May 2025
Event dates: 17–23 August 2025
STC G
Papers
10:30–11:00 (Keynote) Advances in magnetic field-assisted finishing
Hitomi Yamaguchi (1), Fukuo Hashimoto (1), Eraldo da Silva (2), Chi Fai Cheung (1)
Room: M1
Paper ID: F Kn (Keynote)
Day: 20 Wed
11:00–11:30 Materials removal mechanism in laser-assisted grinding of SiC fibre reinforced Titanium alloy composite
Dongdong Xu, Tiancheng Ai, Zifu Shen, Shuan Ma, Md Saddam Hossen, Zhirong Liao (2)
Room: M1
Paper ID: G-1
Day: 20 Wed
11:30–12:00 Consideration of thermally induced material modification depth for grinding process cycle design
Gerrit Kuhlmann, Lars Langenhorst, Tobias Hüsemann, Carsten Heinzel (2)
Room: M1
Paper ID: G-2
Day: 20 Wed
13:30–14:00 Electromagnetic field-assisted ultra-precision grinding of single-crystal Ni-based superalloy
Te Zhao, Suet To (2), Tengfei Yin, Xiangqian Jiang (1)
Room: M1
Paper ID: G-3
Day: 20 Wed
14:00–14:30 Kinetic analysis of workpiece rotation behavior during double-sided polishing
Urara Satake, Yuta Seguchi, Toshiyuki Enomoto (1)
Room: M1
Paper ID: G-4
Day: 20 Wed
14:30–15:00 Atomic-level flat polishing of polycrystalline diamond by combining plasma modification and chemical mechanical polishing
Song Yuan, Benny C.F. Cheung (1), Alborz Shokrani (2), Zejin Zhan, Chunjin Wang
Room: M1
Paper ID: G-5
Day: 20 Wed
15:00–15:30 High-efficiency modification mechanism of GaN(0001) in plasma-assisted polishing using hydrogen plasma
Tong Tao, Rongyan Sun, Yuji Ohkubo, Kazuya Yamamura (2)
Room: M1
Paper ID: G-6
Day: 20 Wed
16:00–16:30 Robust estimation of chip clogging with supervised learning using tool surface image
Tatsuya Furuki, Koichi Nishigaki, Takashi Suda, Hirofumi Suzuki (1)
Room: M1
Paper ID: G-7
Day: 20 Wed
16:30–17:00 Ultrasonic assisted abrasive nano-blasting
Ashwani Pratap, Wule Zhu (2), Mori Yuka, Anthony Beaucamp (2)
Room: M1
Paper ID: G-8
Day: 20 Wed
17:00–17:30 Mitigation of Cu dishing in chemical mechanical polishing using micro-structured pads
Seulah Park, Sukkyung Kang, Dong Geun Kim, Sanha Kim (2)
Room: M1
Paper ID: G-9
Day: 20 Wed
17:30–18:00 A glycerol-based slurry for Cs2LiYCl6 crystal polishing
Jiang Guo, Ankang Yuan, Jing Li, Zhe Yang, Zili Zhang, Lin Li (1)
Room: M1
Paper ID: G-10
Day: 20 Wed